1. Product description
The main preparation methods of copper clad aluminum plate used for radiator include explosive cladding, rolling cladding, casing extrusion cladding, double flow casting cladding and casting rolling cladding. Although there are many preparation processes, each has its limitations. The explosive compound method can produce wide medium and thick plates, but the plate shape is poor, the yield is low, and there are hidden dangers in safety, which cannot ensure continuous production. Although the asynchronous rolling composite technology is used in the rolling composite method, which can improve the strength and preparation width, the metallurgical bonding effect is poor, and the subsequent diffusion heat treatment cannot repair the inherent lack of metallurgical bonding at the composite interface, and the process flow is long. The double strand continuous casting composite method (liquid-liquid composite) can achieve good metallurgical bonding, but the composite interface is difficult to control, which is easy to cause the transition growth and ablation of the interface layer during the composite process. The material performance is uneven and the equipment is complex.
2. Product Features
At present, the research of metal layered composites focuses on its composite process, while the research on the bonding mechanism and performance of heterogeneous metal composites is less. With the development of computer technology, the numerical simulation technology of finite element method is applied to simulate the material processing to obtain the stress field, strain field, temperature field and residual stress field of the composite process, so that the processing parameters can be optimized. In addition, the service life of some composites will be affected by the changes of interface structure, mechanical, corrosion and electrical properties due to environmental factors during use.
3. Application
The application on high-power LED packaging heat dissipation substrate is still unable to
Perfectly solve the core problem of photoelectric conversion efficiency, so heat dissipation is the bottle of LED industry development
In addition to adding heat dissipation devices, packaging is the core to solving the heat dissipation problem. At present, most high-power LED packaging technologies use MCOB packaging. Compared with the traditional COB packaging technology, the chips welded to the aluminum substrate of MCOB have no insulation layer, and the heat is directly introduced to the metal substrate. The heat is quickly exported, reducing the chip junction temperature and extending the service life of the plane light source. The total thermal conductivity of aluminum substrate in the traditional COB packaging mode is 2.2w/m · k, while the current overall thermal conductivity of MCOB is above 200w/m · k.
4. FAQ
Copper clad aluminum plate used for the radiator is a kind of composite material with a layer of copper plate and strip on one or both sides of aluminum. It not only has the advantages of good conductivity, thermal conductivity, low contact resistance, easy electroplating, and the beautiful appearance of copper, but also has the characteristics of lightweight, excellent heat dissipation, and economy of aluminum. It is widely used in the fields of electronics, communications, electrical appliances, power, heat dissipation, automobiles, building decoration, living appliances, etc.
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